Media Summary: System-Level Design talks with Sonics CEO Grant Pierce about the How do you design and verify a package with tens of millions of pins without losing months to manual rework? In this episode of ... Juan Rey, senior director of engineering for Mentor Graphics' Design To Silicon Division, talks about

3d Ic Stacking Challenges - Detailed Analysis & Overview

System-Level Design talks with Sonics CEO Grant Pierce about the How do you design and verify a package with tens of millions of pins without losing months to manual rework? In this episode of ... Juan Rey, senior director of engineering for Mentor Graphics' Design To Silicon Division, talks about To compensate for the gradual slowing down of Moore's Law scaling, we need to introduce other techniques. One option is to ... Shifting left to integrate testing as early as possible in the design cycle is one of the best ways to speed up product development. According to ITRS, logic transistor scaling faces limitation at 10nm. No more cost advantage could be expected from further ...

Chiplets aren't the only way forward in chip design. This deep dive explores an alternative that starts with layered logic ... Why is thermal analysis no longer an afterthought in Find more great content from Cadence: Subscribe to our YouTube channel: ... In the United States, data centers already consume two percent of the electricity available with consumption doubling every five ... Demonstrate what are the Advanced Package Device process ESD risk using with AC Bar Ionizer and QuadPoint Steady-State ... Device scaling faces it limitation. No cost advantage could be expected from device scaling any more. So,

As consumer electronic devices grow increasingly connected, intelligent and advanced, designers need new methodologies such ... The panel discussion comes to a close in part 5 of the highlight reels with questions posed by Pete Singer, editorial director of ... Disaggregating SoCs allows chipmakers to cram more features and functions into a package than can fit on a reticle-sized chip.

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3D IC Stacking Challenges
3D IC Podcast | Current State of 3D IC Design
Breaking down 50 million pins: A smarter way to design 3D IC packages – Podcast Ep. 16
The Challenge Of 3D
Stacking chips using 3D heterogeneous integration
3D IC Podcast | 3D IC Integration Challenges
3D IC Podcast | Uncovering 2.5D and 3D IC Tests
3D IC for Logic - Opportunities, Challenges, and Suggestions
Monolithic 3D: Stacking Without Chiplets
3D IC podcast | The hidden heat challenge of 3D IC: and what designers need to know - podcast ep. 12
3D-IC design, analysis and implementation - Cadence Integrity 3D-IC platform
Learning from sand castles to build future computers
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3D IC Stacking Challenges

3D IC Stacking Challenges

System-Level Design talks with Sonics CEO Grant Pierce about the

3D IC Podcast | Current State of 3D IC Design

3D IC Podcast | Current State of 3D IC Design

3D IC

Sponsored
Breaking down 50 million pins: A smarter way to design 3D IC packages – Podcast Ep. 16

Breaking down 50 million pins: A smarter way to design 3D IC packages – Podcast Ep. 16

How do you design and verify a package with tens of millions of pins without losing months to manual rework? In this episode of ...

The Challenge Of 3D

The Challenge Of 3D

Juan Rey, senior director of engineering for Mentor Graphics' Design To Silicon Division, talks about

Stacking chips using 3D heterogeneous integration

Stacking chips using 3D heterogeneous integration

To compensate for the gradual slowing down of Moore's Law scaling, we need to introduce other techniques. One option is to ...

Sponsored
3D IC Podcast | 3D IC Integration Challenges

3D IC Podcast | 3D IC Integration Challenges

A common

3D IC Podcast | Uncovering 2.5D and 3D IC Tests

3D IC Podcast | Uncovering 2.5D and 3D IC Tests

Shifting left to integrate testing as early as possible in the design cycle is one of the best ways to speed up product development.

3D IC for Logic - Opportunities, Challenges, and Suggestions

3D IC for Logic - Opportunities, Challenges, and Suggestions

According to ITRS, logic transistor scaling faces limitation at 10nm. No more cost advantage could be expected from further ...

Monolithic 3D: Stacking Without Chiplets

Monolithic 3D: Stacking Without Chiplets

Chiplets aren't the only way forward in chip design. This deep dive explores an alternative that starts with layered logic ...

3D IC podcast | The hidden heat challenge of 3D IC: and what designers need to know - podcast ep. 12

3D IC podcast | The hidden heat challenge of 3D IC: and what designers need to know - podcast ep. 12

Why is thermal analysis no longer an afterthought in

3D-IC design, analysis and implementation - Cadence Integrity 3D-IC platform

3D-IC design, analysis and implementation - Cadence Integrity 3D-IC platform

Find more great content from Cadence: Subscribe to our YouTube channel: ...

Learning from sand castles to build future computers

Learning from sand castles to build future computers

In the United States, data centers already consume two percent of the electricity available with consumption doubling every five ...

Enabling QuadPoint Ionization for Advanced Package Device Process

Enabling QuadPoint Ionization for Advanced Package Device Process

Demonstrate what are the Advanced Package Device process ESD risk using with AC Bar Ionizer and QuadPoint Steady-State ...

3D IC Podcast | Getting Started with 3D IC

3D IC Podcast | Getting Started with 3D IC

Engineers can find

3D IC - Opportunities, Challenges, and TRUE 3D IC

3D IC - Opportunities, Challenges, and TRUE 3D IC

Device scaling faces it limitation. No cost advantage could be expected from device scaling any more. So,

3D IC Podcast | An introduction to 3D IC

3D IC Podcast | An introduction to 3D IC

As consumer electronic devices grow increasingly connected, intelligent and advanced, designers need new methodologies such ...

BrightSpots 3D IC Panel - Part 5: Heat Issues with Chip Stacking

BrightSpots 3D IC Panel - Part 5: Heat Issues with Chip Stacking

The panel discussion comes to a close in part 5 of the highlight reels with questions posed by Pete Singer, editorial director of ...

Testing 2.5D And 3D-ICs

Testing 2.5D And 3D-ICs

Disaggregating SoCs allows chipmakers to cram more features and functions into a package than can fit on a reticle-sized chip.

Stanford Seminar - Low-Cost 3D Chip Stacking with ThruChip Wireless Connections

Stanford Seminar - Low-Cost 3D Chip Stacking with ThruChip Wireless Connections

"Low-Cost

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